Analysis of Carbon Nano Structures for On-chip Interconnect Application

This paper proposes the carbon nano structures particularly Carbon nanotube (CNT), Graphene Nanoribbon (GNR), with excellent electrical, thermal and mechanical properties making them an emerging alternative for future onchip interconnect applications. Analysis of CNT and GNR as onchip interconnect has been performed with the help of existing equivalent circuit model. Performance metrics such as delay, bandwidth, power delay product (PDP) have been considered. Performances of carbon nano structures (CNT and GNR) are better than Cu interconnect at all levels of interconnect, even when the technology scales below 22nm. The Single Layer GNR and Single Walled CNT exhibit only 0.5% and 0.7% of the delay observed in copper interconnects respectively. Extreme reduction in power dissipation has also been justified with the results. Thus it obeys Moore’s law even when technology scales into tens of nanometer.